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SX Series Semi-automatic Wafer Probe Station
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Specification
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Model
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SX-6
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SX-8
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SX-12
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Dimension（W*L*H）
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1000mm * 1400mm * 1400mm
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1100mm * 1500mm * 1400mm
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1200mm * 1600mm * 1400mm
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Weight(about)
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1000KG
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1150KG
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1350KG
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Electricity Demand
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AC220V，50~60Hz
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CDA demand
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0.4~0.8Mpa
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Chuck
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Size
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6″
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8″
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12″
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X-Y Travel range
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200mm * 300mm
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250mm * 400mm
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350mm * 500mm
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X-Y Resolution
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0.1μm
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X-Y Repeatability
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≤±1μm
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X-Y Move speed
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≥70mm/sec
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Z Travel range
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20mm
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Z Resolution
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0.1μm
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Z Repeatability
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≤±1μm
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Z Move speed
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≥20mm/sec
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Theta Travel range
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±10°
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Theta resolution
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0.0001°
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Sample Fixed mode
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Vacuum adsorption , Independent control
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Sample Exchange
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Chuck quickly roll out for wafer fast exchange.
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Structure
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Triaxial ultra-low noise design,Gold plating, Chuck surface is electrical floating
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Platen
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Specifications
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O shape platen, 12 micropositioners available（When the octagon box is not installed）
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Microscope
X-Y-Z
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X-Y Travel range
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2″* 2″
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X-Y Resolution
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0.1μm
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X-Y Repeatability
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±2μm
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X-Y Move speed
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≥10mm/sec
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Z Travel range
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5″
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Z Resolution
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0.1μm
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Z Repeatability
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≤ ±1μm
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Z Move speed
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≥10mm/sec
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Microscope
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Variable magnification microscope
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Zoom:15：1,Three gears and could display low(0.6X) and high(2.5X or 9X)
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magnification in the same time
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Camera
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Double cameras（200W or 500W Industrial digital camera）
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Micropositioner Specification
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Mechanical resolution
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10μm / 2μm / 0.7μm
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X-Y-Z Move range
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13mm-13mm-13mm
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Current leakage
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10pA / 100fA / 10fA
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Connector type
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Banana plug adapter/Coaxial /Three-axis/ SMA /SHV etc.
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Base
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Magnetic/vacuum adsorption base
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Temperature
specification
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Temperature range
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﹣60℃-200℃ (Standard), other Temperature range upon request
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Temperature stability
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±0.1℃
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Tmeperature resolution
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0.01℃
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Heating time(12″chuck)
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﹣60℃ to +25℃ ≤ 10min
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+25℃ to +200℃ ≤10 min
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Cooling time(12″chuck)
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﹢200℃ to +25℃ ≤ 12min
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﹢25℃ to -60℃ ≤ 25min
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Noise
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＜60dB
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Heating method
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Low Voltage DC(LVDC)/PID control
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Refrigeration method
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Refrigeration compressor
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Anti-Vibration
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Anti-Vibration method
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Air film anti-vibration system，Ensure nonvisible vibration in the screen
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when the microscope zooming in at 2000X
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Vibration suppression
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In the process of chuck movement, it can be extremely fast to ensure the
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stability of the chuck ≤1S, Improve the test efficiency.
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system mask
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EMI shielding
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> 30 dB (typical) @ 1 kHz to 20GHz
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Light attenuation
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≥ 130 dB
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Spectral noise floor
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≤ -180 dBVrms/rtHz
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System AC noise
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≤5 mVp-p (≤ 1 GHz)
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Software function
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Automatic wafer alignment
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Automatic wafer height measurement and compensation
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Automatic Die size measurement and auto mapping
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Wafer map edit arbitrary
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Demarcate difference data with Ink mark
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Real-time test results display
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Easy data management of the instrument input/output
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The test results can be divided into different bin values
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Multi tester fast integration , support both single Die testing and continuous testing
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Support Z, N shape test
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One touch automatic RF calibrate and probe tips cleaning
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Separation of OS and application software, can be upgraded independently.
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Robust data storage and processing capabilities
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Automatic data and curves storage and remote access
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Communication interface：R232/485/TCP/IP/GPIB
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Characteristic
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Ultrahigh test accuracy, efficiency and stability
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Convenient tester integration
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Mult magnification simultaneous display optical system
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High power wafer test Upgradable
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-60~200℃ super low noise chuck
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RF test Upgradable
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Feature-rich test software.
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Fully automatic wafer test Upgradable
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