Semiconductor as much starker choices-and graver consequences-in planning in China, we will vigorously support of science and technology industry in the recent years in our country present a rapid growth trend, the 2017 China's integrated circuit industry sales of 541.13 billion yuan, up 24.8% from a year earlier, fastest-growing integrated circuit manufacturing, rose 28.5% in 2017, sales of 144.81 billion yuan and chip (chip) is a integrated circuit (IC, integrated circuit) of the carrier, it is made of pieces of wafer cut (wafer)In driven by Moore's law, from 6 inch 8 inch wafer size 12 "the path of the change, because the wafer diameter, the greater the same wafer can produce the more integrated circuit, both to reduce the cost, but at the moment, and can improve the yield and utilization in the wafer test especially the manual testing will produce an inevitable question: from the wafer after a test chip moves to the next is likely to become more and more far distance of the chip under test, mobile is also likely to become more and more high frequency, and wafer test at the same time also has the characteristics of high precision, the current is usually a few microns or even a few microns.

Current mobile way, the traditional screw guide XY translation machine manufacture high precision cost but when test sample movement speed slow lead to low efficiency, synchronous gear with synchronous belt transmission structure can't satisfy the requirement of the level of micron semiconductor test precision, so now urgently need a can easily move quickly and firmly locked displacement device.

Technical Summary

Technical Name：Chuck Air bearing move^TM

Type of patent: Invention Patent

Patent Number：201910551099.7

Chuck Air bearing move^TM provides a wafer can be easily move quickly and firmly lock the wafer testing displacement device and wafer testing machine is used by the base set a surface seal area, seating area and set up a relatively smooth plane form sealed cavity, and Settings can generate high pressure and low pressure gas generator, the sealing area, connected in produce high pressure gas, high pressure gas buoyancy make samples bearing structure is easy to move;When the low-pressure gas is generated, the vacuum suction generated by the low-pressure gas makes the sample bearing structure firmly fixed, which can easily and quickly move the wafer and firmly lock it.

Displacement of the present invention provides a wafer testing device, used to move the sample bearing structure to the preset position, including the base pressure generating device, described the base used in the sample bearing structure of fixed, described the base surface has a seating area, described in the sealing area and set up a relatively smooth plane form sealed cavity, described in the sealing area of pressure generating device connected, described pressure generating device generates high pressure and low pressure gas, producing high pressure gas, buoyancy make samples bearing structure of high pressure gas is easy to move;When the low-pressure gas is generated, the vacuum suction generated by the low-pressure gas makes the sample bearing structure firmly fixed.

Further, the sealing area is arranged on the surface close to the sample bearing structure, and the smooth plane is arranged on the surface close to the base of the sample bearing structure. When high pressure gas is generated, the buoyancy of the high pressure gas counteracts part of the gravity of the sample bearing structure so that the sample bearing structure can move easily;When the low-pressure gas is generated, the vacuum suction generated by the low-pressure gas causes the sample bearing structure to be adsorbed on the base, so that the sample bearing structure is firmly fixed.

Further, the sample bearing structure includes a translation structure sample carrier, which is arranged on the translation structure, which is arranged on the base, and the smooth plane is arranged on the surface of the translation structure close to the base.

Further, pneumatic devices include tracheal joint air valve control high voltage low voltage sources structure, described the trachea joints located above the base, high voltage low voltage sources described valve connection stated, respectively described valve tracheal joints connected with stated, described the trachea joints connect and described in the sealing area, control valve connection stated, structure to control valve selection described connecting high voltage source, or low pressure source, pressure generating device described in high pressure and low pressure gas is used to switch between.

Further, described the base is equipped with five tracheal joints, one of the sealing area of tracheal joint connection, the remaining four, two high voltage source connected to low voltage source with the stated, the other two valve connected with the stated, and the high voltage source connected to low voltage source of two separate mentioned in connection with air valve connected to two, in order to realize high voltage low voltage sources described respectively connect the air valve.

Further, the air valve comprises a valve body windpipe elbow, and the windpipe elbow is connected to the corresponding screw hole of the body.

Further, the control structure includes a control lever return spring handle with a sleeve arranged in the handle that can move in a relative axial direction, the return spring is located between the control lever and the handle, and the control lever is connected to the air valve for controlling the air valve.

Further, a fixer is also included, the air valve is fixed in the fixer, the fixer is fixed to the base, and the handle is fixed in the fixer.

Further, the sealing area comprises a cavity sealing groove O sealing ring that surrounds the cavity and is embedded in the sealing groove.

The invention also provides a wafer testing machine, including a sample bearing structure of a wafer testing displacement device, which is the structure described above and is located on the wafer testing displacement device for bearing a wafer sample to be tested.